Manufacturing capabilities

Please view our Design Guidelines before using minimum capabilities.

Specification Value
Track-to-Track Clearance 0.20mm (8 mil)
Track Width 0.20mm (8 mil)
Minimum feature to board outline 0.25mm (10 mil)
Silkscreen width 0.20mm (8 mil)
Board outline 0.20mm (8 mil)
Minimum Annular ring size 0.20mm (8 mil)
Solder mask expansion 0.15mm (6 mil)
Minimum via hole size (first drilled 0.6mm) 0.5 mm (20mil)
Minimum hole size 0.6 mm (24mil)
Hole diameter tolerance <0.05mm (2mil)
Maximum single sided board size 400mm x 400mm
Maximum through hole plated board size

400mm x 400mm

Depending on the design, certain manufacturing guidelines can be exceeded,

should you require a printed circuit board with specifications not listed above, please enquire prior to your order.

Product Specifications:

Product Single Sided, Double Sided Through hole plated
Material FR4, Polyimide
Copper Thickness 35 micron ; 70 micron
Copper Laminate Thickness 0.8mm 1.0mm 1.6mm 2.4mm
Solder Mask Liquid Photo Image -Dark Green, Blue, Black
Silkscreen Legend White
Edge Profile V-score or smoothed
Board Supply Panel or individual
Inspection Optical
Single Sided Finish Immersion Silver, SMOBC (solder mask over bare copper)
Through Hole Plated Finish Immersion Silver
Film imaging resolution 2000dpi - 2400dpi
Data files accepted Gerber RS274-X, Gerber RS274-D
Slot Drill Size Available 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.8mm 2mm, 2.5mm, 3mm


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